Company Name: Excellent Integrated System LIMITED

Contact Person : John

Email/Msn     :John(at)eis-ic.com

Tel: 00852-30777742

Add.: RM 906, WORKINGBERG COMM BLDG, 41-47 MARBLE RD, HONGKONG

Excellent Integrated System LIMITED (EIS LIMITED), Established in 1991, is a professional independent stocking distributor of electronic components and specialize in buying the EXCESS STOCK from the original equipment manufacturers (OEMs), Contract equipment manufacturers (CEMs), and many other factories. EIS has gained good experiences in Excess Inventory Management through its development over 20 years and has become the reliable partner for the domestic and foreign OEM manufacturers. If any inquiry and question,please email us: John(at)eis-ic.com.

Description as follow:

The XC3S700A-4FGG484C is a 1.2V Field-Programmable Gate Array. It solves the design challenges in many high-volume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates, the Extended XC3S700A-4FGG484C provides a broad range of densities and package options, integrated DSP MACs, and low total system cost while increasing functionality. The XC3S700A-4FGG484C also includes the nonvolatile Spartan-3AN devices, which combine leading-edge FPGA and flash technologies to provide a new evolution in security, protection and functionality, ideal for space-critical or secure applications.

Parametrics

XC3S700A-4FGG484C absolute maximum ratings: (1)Internal supply voltage:-0.5V to 1.32V; (2)Auxiliary supply voltage:-0.5V to 3.75V; (3)Output driver supply voltage:-0.5V to 3.75V; (4)Input reference voltage:-0.5V to VCCO+0.5V; (5)Voltage applied to all User I/O pins and dual-purpose pins:-0.95V to 4.6V; (6)Voltage applied to all Dedicated pins:-0.5V to 4.6V; (7)Input clamp current per I/O pin:±100mA; (8)Junction temperature:125℃; (9)Storage temperature:-65℃ to 150℃.

Features

XC3S700A-4FGG484C features: features: (1)Very low-cost, high-performance logic solution for high-volume, cost-conscious applications; (2)Low-cost QFP and BGA packaging, Pb-free options; (3)Flexible power management; (4)Leading connectivity platform; (5)Abundant, flexible logic resources; (6)Dedicated resources for high-speed digital signal processing applications; (7)Precise clock management with up to eight Digital Clock Managers(DCMs); (8)Integrated flash memory in Spartan-3AN devices; (9)Eight low-skew global clock networks, eight additional clocks per half device, plus abundant low-skew routing; (10)Hierarchical SelectRAM memory architecture; (11)Configuration interface to industry-standard PROMs; (12)Complete Xilinx ISE and free WebPACK development system software support; (13)MicroBlaze and PicoBlaze embedded processors reduce risk; (14)Low-cost starter kits from Xilinx, distributors, and third parties; (15)XA versions available for Automotive applications.

Diagrams